1) Which terminology of PCB represents a thin photo-sensitive polymer by supporting photographic pattern of single traces or IC pads for etching?
a. Prepreg
b. Etching
c. Photo-resist
d. Solder mask
|
Answer
Explanation
|
ANSWER: Photo-resist
Explanation:
No explanation is available for this question!
|
|
2) Which among the below mentioned packages does not belong to the category of 'Small Outline Package'?
a. SO
b. SOP
c. SOT
d. SON
|
Answer
Explanation
|
ANSWER: SON
Explanation:
No explanation is available for this question!
|
|
3) Which type of solderability testing is carried out for the generation of solder sample due to immersion of wire or sheet metal specimen in a bath of molten solder?
a. Solder Bath Testing
b. Meniscus Rise Testing
c. Solder Iron Testing
d. None of the above
|
Answer
Explanation
|
ANSWER: Meniscus Rise Testing
Explanation:
No explanation is available for this question!
|
|
4) Which among the below stated soldering methods is also renowned as 'High Frequency Resistance Soldering'?
a. Iron Soldering
b. Furnace Soldering
c. Torch Soldering
d. Electrical Soldering
|
Answer
Explanation
|
ANSWER: Electrical Soldering
Explanation:
No explanation is available for this question!
|
|
5) Which among the below mentioned approaches belongs to the category of In-circuit Testing?
a. Impedance Testing
b. Component Testing
c. Apply Signal and check output
d. All of the above
|
Answer
Explanation
|
ANSWER: All of the above
Explanation:
No explanation is available for this question!
|
|
6) High current circuits are purposely located or placed near the edge of PCB in accordance to the supply lines for ________
a. Removal of heat
b. Isolation of stray current
c. Reduction of path length
d. All of the above
|
Answer
Explanation
|
ANSWER: Removal of heat
Explanation:
No explanation is available for this question!
|
|
7) What is/are the necessity/ies to provide guarding to precision differential amplifiers?
a. To increase leakage resistance
b. To reduce capacitance between signal conductors & ground
c. Both a and b
d. None of the above
|
Answer
Explanation
|
ANSWER: Both a and b
Explanation:
No explanation is available for this question!
|
|
8) Which phenomenon is not reduced by the circuit paths of lowest impedances especially provided by power and return planes for shielding purposes?
a. Radiation
b. Convection
c. Noise
d. Crosstalk
|
Answer
Explanation
|
ANSWER: Convection
Explanation:
No explanation is available for this question!
|
|
9) Which among the below specified assertions is not a grounding consideration associated with ADC as well as DAC?
a. Analog side to analog ground
b. Digital side to digital ground
c. Use of separate power supply and connection of their ground leads to single point reference
d. Reduction of inductive loop area between power and return traces
|
Answer
Explanation
|
ANSWER: Reduction of inductive loop area between power and return traces
Explanation:
No explanation is available for this question!
|
|
10) Which among the below stated devices/equipments are preferred for elimination of ground and supply line noise especially in TTL/CMOS / ECL PCB designing?
a. Coupling capacitor
b. Decoupling capacitor
c. Snubber circuits
d. All of the above
|
Answer
Explanation
|
ANSWER: Decoupling capacitor
Explanation:
No explanation is available for this question!
|
|
