Electronics Product Design - Electronic Engineering (MCQ) questions & answers
Dear Readers, Welcome to Electronics Product Design multiple choice questions and answers with explanation. These objective type Electronics Product Design questions are very important for campus placement test, semester exams, job interviews and competitive exams like GATE, IES, PSU, NET/SET/JRF, UPSC and diploma.
Specially developed for the Electronic Engineering freshers and professionals, these model questions are asked in the online technical test and interview of many companies.
These tutorial are also important for your viva in university exams like Anna university, Pune, VTU, UPTU, CUSAT etc.
1) Which among the following exhibits a contributory role in an invention of CDMA system?
- Published on 25 Sep 15
a. Unicomm
b. Dualcomm
c. Qualcomm
d. Pentacomm
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2) Which compression coding scheme of vocoder in GSM has a provision of 13 kbps voice bit stream by allowing the transmission of eight telephone calls concurrently in a single 200-ku-wide channel?
- Published on 25 Sep 15
a. Regular Pulse Excitation Linear Predictive Coding
b. Residual Excited Linear Predictive Coding
c. Both a and b
d. None of the above
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3) Which among the following can be used to analyze the frequency response of a room?
- Published on 25 Sep 15
a. Spectrum Analyzer
b. Pink Noise Generator
c. Both a and b
d. None of the above
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4) A Gaussian filter plays an important role in shaping the serial digital bit stream into narrow signal bandwidth ________
- Published on 25 Sep 15
a. Before modulation
b. During (at the time of) modulation
c. After modulation
d. None of the above
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5) Which among the below mentioned packages does not belong to the category of 'Small Outline Package'?
- Published on 25 Sep 15
a. SO
b. SOP
c. SOT
d. SON
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6) Which type of solderability testing is carried out for the generation of solder sample due to immersion of wire or sheet metal specimen in a bath of molten solder?
- Published on 25 Sep 15
a. Solder Bath Testing
b. Meniscus Rise Testing
c. Solder Iron Testing
d. None of the above
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7) Which among the below stated soldering methods is also renowned as 'High Frequency Resistance Soldering'?
- Published on 25 Sep 15
a. Iron Soldering
b. Furnace Soldering
c. Torch Soldering
d. Electrical Soldering
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8) Which among the below mentioned approaches belongs to the category of In-circuit Testing?
- Published on 25 Sep 15
a. Impedance Testing
b. Component Testing
c. Apply Signal and check output
d. All of the above
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9) High current circuits are purposely located or placed near the edge of PCB in accordance to the supply lines for ________
- Published on 25 Sep 15
a. Removal of heat
b. Isolation of stray current
c. Reduction of path length
d. All of the above
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10) Malice type of software bug under the Intent category occurs due to __________
- Published on 25 Sep 15
a. Limits on operation
b. Coding operation inefficiency
c. Incorrect data type
d. Viruses
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